射频电路和射频集成电路设计中的关键课题

出版时间:2005-2  出版社:高等教育出版社  作者:Richard Chi-Hsi Li  页数:395  字数:490000  
Tag标签:无  

内容概要

本书着重论述和强调在射频电路和射频集成电路设计中的共同的关键性课题。内容包括:射频和射频集成电路设计的核心部份: 阻抗匹配;基本射频参数和方程式;射频接地;从单端线路到差分线路;容许误差分析;射频集成电路设计中的难题;低噪声放大器设计的讨论。    本书的读者对象是大学的高年级学生、研究生和工程技术人员。My motivation to write this book    Today, many books about RF (Radio Frequency) circuit design are available for students, researchers, and designers.  In these books, the operating principles and circuit topologies are well explained and presented.  In addition to offer training of the use of simulation tools, they enable a student who has just graduated from university to start RF circuit designing in his/her new job.

作者简介

Richard Chi-Hsi Li,male, was born in NanAn,QuanZhou ,Fujian,China .He graduated in the Physics Department of FuDan Unversity,Shanghai,China in 1985.From 1958 to 1973 .he and been working for the Institute of Geophysics ,Chineseacademy and the University o

书籍目录

Chapter 1 Importance of Impedance Matching 1.1 Difference between RF and Digital Circuit Design  1.1.1 Case 1: Digital Circuits at Low Data Rate  1.1.2 Case 2: Digital Circuits at High Data Rate 1.2 Significance of Impedance Matching  1.2.1 Power Transportation from a Source to a Load  1.2.2 Maximizing of Power Transportation without Phase Shift  1.2.3 Conjugate Impedance Matching and Voltage Reflection Coefficient  1.2.4 Impedance Matching Networ 1.3 Problems due to Unmatched Status of Impedance  1.3.1 General Expression of Power Transportation  1.3.2 Power Instability and Additional Power Los  1.3.3 Additional Distortion and Quasi-Noise  1.3.4 Power Measurement  1.3.5 Power Transportation and Voltage Transportatio  1.3.6 Burning of a Transistor ReferencesChapter 2 Impedance Matching 2.1 Impedance Measured by Small Signal  2.1.1 Impedance Measured by S Parameter Measurement  2.1.2 The Smith Chart: Impedance and Admittance Coordinatio  2.1.3 Accuracy of Smith Chartl  2.1.4 Relationship between the Impedance in Series and in Parallel 2.2 Impedance Measured by Large Signal  2.3 Impedance Matching  2.3.1 One Part Matching Network  2.3.2 Recognition of Regions in a Smith Chart  2.3.3 Two Parts Matching Network  2.3.4 Two Parts Upward and Downward Impedance Transformer  2.3.5 Three Parts Matching Network and Impedance Transformer   2.3.5.1 Topology Limitation of Two Parts Matching Network   2.3.5.2 Π Type Matching Network    2.3.5.3 T Type Matching Network 2.4 Some Useful Schemes for Impedance Matching   2.4.1 Designs and Tests when ZL is not 50 Ω  2.4.2 Conversion between“T” and “Π” Type Matching Network  2.4.3 Parts in a Matching Network  2.4.4 Impedance Matching between Power Transportation Units  2.4.5 Impedance Matching for a Mixer ReferencesChapter 3RF Grounding 3.1 A True Story 3.2 Three Components for RF Grounding  3.2.1 “Zero” Capacitors   3.2.2 Micro Strip Line  3.2.3 RF Cable 3.3 Examples of RF grounding  3.3.1 Test PCB   3.3.1.1 Small Test PCB   3.3.1.1.1 Basic Types of Test PCB    3.3.1.1.2 RF Grounding with a Rectngular Metallic Frame   3.3.1.1.3 An Example    3.3.1.2 Large Test PCB   3.3.1.2.1 RF Grounding by “Zero” Chip Capacitors    3.3.1.2.2 RF Grounding by a Runner or a Cable with Half or Quarter Wavelength  3.3.2 Isolation between Input and Output in a Mixer or an Up-converter  3.3.3 Calibration for Network Analyzer 3.4 RF Grounding for Reduction of Return Current Coupling  3.4.1 A Circuit Built by Discrete Parts on a PCB   3.4.2 RFICs ReferencesChapter 4 Equivalent Circuits of Passive Chip Parts 4.1 Modeling of Passive Chip Parts 4.2 Characterizing of Passive Chip Parts by Network Analyzer 4.3 Extraction from the Measurement by Network Analyzer  4.3.1 Chip Capacitor  4.3.2 Chip Inductor  4.3.3 Chip Resistor 4.4 Summary ReferencesChapter 5 Single-ended Stage and Differential PairChapter 6 Balun217Chapter 7 Tolerance Analysis239Chapter 8 Prospect of RFIC Design269Chapter 9 Noise, Gain, and Sensitivity of a Receiver317Chapter 10 Non-linearity and Spurious Products339Chapter 11 Cascaded Equations and System Analysis 358Chapter 12 From Analog to Digital Communication System376

图书封面

图书标签Tags

评论、评分、阅读与下载


    射频电路和射频集成电路设计中的关键课题 PDF格式下载


用户评论 (总计2条)

 
 

  •   E文中的才好用下。希望后版内容丰富一些,有实例具体才好
  •   内容可以说是可以的,其实就是经验之谈,可以作为知识的补缺。英语水平嘛马马虎虎,中国式英语,唯一缺点是比较贵,可能是“英文版”吧,哈哈。
 

250万本中文图书简介、评论、评分,PDF格式免费下载。 第一图书网 手机版

京ICP备13047387号-7